Die Bonder - Company Ranking(12 companies in total)
Last Updated: Aggregation Period:Dec 17, 2025〜Jan 13, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ... | LED-related items such as COB, CSP, phosphor film, and TOcan. | ||
Dai Bonder "MEGA"
Other |
【Specifications】 ■Alignment accuracy: ±2μm to 25μm (standard 25μm) ■Cycle time: up to 0.25 seconds/chip ■Die size compatibility: 0.15×0.15-1... | For more details, please refer to the PDF document or feel free to contact us. | |
| ASM's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can pr... | We have a wealth of experience in various applications such as LED-related, Opto solutions, and sensor-related fields. | ||
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- Featured Products
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ASMPT manufactured AD838L-G2 epoxy die bonder
- overview
- ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ...
- Application/Performance example
- LED-related items such as COB, CSP, phosphor film, and TOcan.
Dai Bonder "MEGA"
- overview
- 【Specifications】 ■Alignment accuracy: ±2μm to 25μm (standard 25μm) ■Cycle time: up to 0.25 seconds/chip ■Die size compatibility: 0.15×0.15-1...
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
ASMPT AD830Plus Epoxy Die Bonder
- overview
- ASM's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can pr...
- Application/Performance example
- We have a wealth of experience in various applications such as LED-related, Opto solutions, and sensor-related fields.
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